South Korea’s Samsung Electronics has entered into an agreement with U.S. chipmaker and designer Broadcom to expand their collaboration on artificial intelligence chips.

The announcement was timed to coincide with South Korean President Lee Jae Myung’s visit to Silicon Valley on July 24-25, which was aimed at strengthening trade ties between South Korea and U.S. technology companies.

In a statement, the companies said they had signed a memorandum of understanding to work together on memory and foundry technologies to support the next generation of AI infrastructure.

The alliance, which will see Samsung manufacture chips for Broadcom, is expected to be worth more than $200 billion through 2030. Samsung said the deal reflects its “continued focus on supporting customers with end-to-end semiconductor technologies across an increasingly diverse range of AI and high-performance computing applications.”

Samsung and Broadcom said they will supply industry-leading memory systems, including high-bandwidth memory (HBM), to support the U.S. company’s next-generation AI accelerators.

The agreement also covers Broadcom’s high-speed communications chips, which will be made using Samsung’s sub-2-nanometer process technologies, the companies said. They added that the partnership is intended to deliver improvements in packaging and efficiency.

“AI is driving unprecedented demand for tightly integrated semiconductor technologies spanning memory, logic and advanced packaging,” Young Hyun Jun, head of Samsung’s electronics device solutions division and memory business, said in a statement. “By expanding our collaboration with Broadcom across these critical technologies, we look forward to delivering greater value to customers while advancing the AI infrastructure of the future.”

The expanded collaboration came days after another major South Korean deal, also announced around the presidential visit, when SK Group agreed to a deal worth more than $500 billion with Nvidia to help expand AI infrastructure.

Among the highlights of that agreement was confirmation that SK Group’s planned 2GW cloud in South Korea will use Nvidia’s DSX platform and deploy the company’s Vera Rubin chips.

The companies also said that partnership would include co-development of next-generation AI memory systems, including HBM, to address a range of evolving infrastructure demands, from large language model training to agentic AI and physical AI.